ESTRUTURA DE FITA COM ESFERAS PARA ADESAO AUTOMATIZADA A FITA,EMPACOTAMENTO EM MULTIPLAS CAMADAS,INTERCONEXAO UNIVERSAL DE MICROPLAQUETAS,INVOLUCRO DE EMPACOTAMENTO ELETRONICO E PROCESSOS EMPREGANDO FEIXES DE ENERGIA PARA A FABRICACAO DE FITAS COM ESFERAS

摘要

Automated bonding of chips (12) to tape and formation of bonding structures on Tape Automated Bonding (TAB) packaging structures are provided with bonding balls (38, 238, 338) on the ends of beam leads (13C, 81) of the TAB tape (10C). Also balltape bonding balls (9A, 9B) are aligned on stacked TAB sheets (26, 27) and bonded together to form via interconnections through stacked balltape balls in multilayer, electronic packging structures. Interconnection structures are provided for a universal chip connection laminate which can be applied between a chip (12) and a multilayered ceramic package (133).