| 摘要 |
<p>PURPOSE:To increase the capacity of storing function by providing a first connecting terminal of recess or projecting type on the lower surface of a semiconductor device, providing a second connecting terminal of projecting or recess type of the shape to be engaged with the first terminal on the upper surface of the device, and electrically connecting the first terminal to the second terminal. CONSTITUTION:Each semiconductor device 2 has a plurality of connecting terminals (lead pins) 2A of recess or projecting type on its lower surface (the placing surface of a circuit substrate 1), and a plurality of connecting terminals 2B of projecting or recess type on its upper surface. The terminals 28 are formed in the shape engaged with the terminal 2A provided on the lower surface of the device 2 having the same storing function. The terminals 2A and 2B are constructed to be electrically connected. Thus, a plurality of the devices 2 each having the storing function are stacked to be mounted on the mounting surface of the substrate 1.</p> |
