发明名称 MANICURE COMPOSITION
摘要 PURPOSE:To obtain the titled composition capable of peeling in the form of films formed on nails without using a removing liquid, by dissolving a specific amount of a specified polyamide in a mixed solvent of toluene and butyl acetate and isopropyl alcohol and coloring with a dye, etc. CONSTITUTION:A manicure composition, obtained by dissolving 6.0-11.0wt% polyamide resin consisting of a resin prepared by blending a polycondensate of a compound expressed by formula I (R1 is 2-4C or 6C alkyl; R2 is 1-4C alkyl) with a compound expressed by formula II (R3 is 2-10C alkyl) and a polycondensate of the compound expressed by formula I with a compound expressed by formula III in a solvent obtained by blending (A) toluene with (B) butyl acetate and (C) isopropyl alcohol, preferably at 4.0:4.0:2.0 weight ratio of (A):(B):(C) and adding a dye or pigment to color the solution and capable of forming films having moderate elasticity and gloss on the nails without damaging nails since the films can be readily peeled without using a removing liquid containing a solvent.
申请公布号 JPS63107913(A) 申请公布日期 1988.05.12
申请号 JP19860254236 申请日期 1986.10.25
申请人 SAN PARUKO KK 发明人 OURA YASUSHI
分类号 A61K8/00;A61K8/31;A61K8/34;A61K8/36;A61K8/362;A61K8/37;A61K8/41;A61Q3/02 主分类号 A61K8/00
代理机构 代理人
主权项
地址