| 摘要 |
PURPOSE:To chuck even a substrate having large warpage positively and fix it onto a substrate susceptor, and to facilitate printing while reducing the dispersion of the film thickness of a printing pattern by pushing the substrate in the direction of the substrate susceptor, operating a chuck mechanism installed to the substrate susceptor. CONSTITUTION:An insulating substrate 3 is loaded onto a substrate susceptor 2 under the state in which the substrate susceptor 2 movable along a rail 1 is positioned at a place shown in I, the state in which there is not screen 4 on the substrate susceptor 2. A chuck mechanism mounted on the substrate susceptor 2 is operated, and the insulating substrate 3 is chucked and fastened onto the substrate susceptor 2. The substrate susceptor 2 on which the insulating substrate 3 is loaded is shifted up to a position shown in II, and the top face of the insulating substrate 3 is pressed in the direction of the substrate susceptor 2 by a substrate presser 7. The substrate susceptor 2 on which the insulating substrate 3 is loaded is moved up to a position in the lower section of the screen 4 shown in III, and paste 5 is raked and pushed out by a squeegee 6 through the screen 4, thus transferring a circuit pattern corresponding to the screen 4 onto the insulating substrate 3. |
