发明名称 MULTILAYER CIRCUIT BOARD
摘要 PURPOSE:To prevent the stepped disconnection of conductor patterns, and to improve the reliability of continuity in a notch section for an insulating board by forming a conductive layer containing a thermoplastic resin to at least one part of the periphery of the notch section for the insulating board while the conductor pattern on a first board and the conductor pattern on a second board are thermocompression-bonded through the notch section. CONSTITUTION:Filmy thermoplastic resin boards 11a-11g are superposed and laminated respectively in the order shown in the figure. A notch section 12 and conductor patterns 13, 14 in two layers at specified position are shaped in the board 11c at that time. A land section 17 composed of conductor patterns 15, 16 in two layers and a notch section 18 at predetermined positions are formed in the board 11d. A land section 20 having a diameter larger than the diameter of the notch section is shaped so as to correspond to the lower section of the notch section 18 for the thermoplastic resin board 11d onto the thermoplastic resin board 11e, and hot-pressed as two layer structure with a conductor pattern 19, thus much melting and making to flow the land 20 with approach to the notch sections 12, 18 at the time of hot press and positively connecting the conductor patterns on each board 11c, 11d, 11c, then improving the reliability of continuity in the notch sections.
申请公布号 JPH01220893(A) 申请公布日期 1989.09.04
申请号 JP19880046817 申请日期 1988.02.29
申请人 TOSHIBA CORP 发明人 TAKEUCHI MEGUMI
分类号 H05K3/46 主分类号 H05K3/46
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