| 摘要 |
PURPOSE:To facilitate high density mounting of a semiconductor device by a method wherein a semiconductor element having circuits and electrodes for inputting and outputting electric signals on both sides, inner leads of a lead frame provided around the semiconductor element and metal fine wires connecting the electrodes on both sides of the semiconductor element to both surfaces of the inner leads are sealed with resin. CONSTITUTION:A semiconductor element 1 having circuits and electrodes 2 for inputting and outputting electric signals on both sides, inner leads 3 of a lead frame provided around the semiconductor element 1 and metal fine wires 4 connecting the electrodes 2 on both the sides of the semiconductor element 1 to both sides of the inner leads 3. For instance, in order to obtain the semiconductor element 1 having the circuits on both sides, two conventional semiconductor elements each having a circuit on one side are bonded to each other so as to have no mutual electrical continuity. In order to provide wirings with the fine metal wires 4 on both sides of the semiconductor element 1, wirings on one side are provided by a conventional method and then the semiconductor element 1 and the inner leads 3 are fixed by a method such as resin potting and turned over and wirings on the other side are provided. |
