| 摘要 |
A harmetically sealed circuit assembly (10) containing a plurality of circuit elements (74, 76 and 80) which are to be compression bonded upon application of a force through opposed first and second walls (12, 20) of a hermetically sealed chamber containing the circuit elements to be compression bonded in accordance with the invention includes a plurality of columns (20-30) within the chamber with each circuit element to be compression bonded being disposed in a separate column; an inelastically deformed element (124-132) positioned in each of the columns outside the chamber having a first surface facing an outside surface of one of the first and second walls of the hermetically sealed chamber and a second surface with each of the second surfaces of the deformed springs facing an outside surface of another of the first and second walls; and a thickness of the columns measured between the outside surfaces of the first and second walls prior to compression bonding being substantially identical. |
