发明名称 |
ALIGNING METHOD OF SEMICONDUCTOR WAFERS |
摘要 |
PURPOSE:To automate aligning of the second and subsequent wafers after fine adjustment of the first wafer has been finished by providing first, second aligning line portions to semiconductor wafers, and providing a means of raising and moving the wafers and a means of rotating the wafers in the crossing-point direction on the extention of these two line parts. |
申请公布号 |
JPS5412568(A) |
申请公布日期 |
1979.01.30 |
申请号 |
JP19770078761 |
申请日期 |
1977.06.29 |
申请人 |
SANYO ELECTRIC CO;TOKYO SANYO ELECTRIC CO |
发明人 |
TANAKA TADAHIKO |
分类号 |
H01L21/30;H01L21/027;H01L21/68 |
主分类号 |
H01L21/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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