| 摘要 |
<p>PURPOSE:To make it easy to form packages and ensure that these packages are less susceptible of deformation under an external pressure and thereby are highly reliable by sealing a functional part section airtightly using a resin sealing body and making the thickness of the section almost equal to that of the external margin of a frame. CONSTITUTION:Functional parts of a card such as IC 1 are attached to the surface of circuit base 11b on which circuit connections 13 are formed. A frame 11 in this state is placed in a molding die and the external margin 11a is insetted in the cavity of the die. Thermotropic liquid crystal polymer which is of the same material as the frame 11 is used as an injection molding resin, for example. This resin is injected into the frame 11, then the functional part section is embedded to form a resin sealing body 14 and the both surfaces of the body 14 are flat but slightly lower than the both surfaces of the external margin 11a to form a recessed profile. The flat surface in the recessed section is used for drawing a design of an IC card and also attaching a label or a panel.</p> |
