发明名称 |
METHOD OF FORMING AN INTEGRATED CIRCUIT ASSEMBLY |
摘要 |
<p>A METHOD OF FORMING AN INTEGRATED CIRCUIT ASSEMBLY A method of forming an integrated circuit assembly is disclosed. The method comprises selectively treating a surface of a carrier to delineate a pattern thereon capable of receiving a metal deposit. The pattern is contacted with a conductive lead of an integrated circuit. The pattern is also contacted with a conductive external element and a metal is then deposited on the pattern to form an assembly having a continuous conductive metal pattern joining the lead and the external element. The resultant metal-deposited assembly may then be encapsulated and removed from the carrier.</p> |
申请公布号 |
CA1047653(A) |
申请公布日期 |
1979.01.30 |
申请号 |
CA19750239990 |
申请日期 |
1975.11.19 |
申请人 |
WESTERN ELECTRIC COMPANY, INCORPORATED |
发明人 |
COUCOULAS, ALEXANDER |
分类号 |
H01L23/31;H01L23/498;H05K3/32;(IPC1-7):01L21/56 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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