SUBSTRATE FOR MULTIILAYER WIRING,申请号JP19770075734-传众专利搜索

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发明名称	SUBSTRATE FOR MULTIILAYER WIRING
摘要
申请公布号	JPS549767(A)	申请公布日期	1979.01.24
申请号	JP19770075734	申请日期	1977.06.24
申请人		发明人
分类号	H05K3/46;H01L21/52;H01L23/34;H05K3/30;H05K7/20	主分类号	H05K3/46
代理机构		代理人
主权项
地址

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