发明名称 Cases for enclosing substrates
摘要 The invention relates to a novel case for enclosing a short length of at least one elongate substrate, especially a cable splice. The case has a wrap-around body section and end sections comprising deformable sealing members which in use are deformed into a configuration in which an increase in pressure within the case increases the forces maintaining the sealing members in contact with the substrate. Preferably the case includes heating means which is used to heat the sealing members and to activate a hot melt adhesive placed thereon. The cases are particularly useful for encapsulating splices in pressurized telephone cables.
申请公布号 US4135587(A) 申请公布日期 1979.01.23
申请号 US19770786835 申请日期 1977.04.12
申请人 RAYCHEM CORPORATION 发明人 DIAZ, STEPHEN H.
分类号 G02B6/44;H02G15/10;H02G15/113;(IPC1-7):H02G15/18 主分类号 G02B6/44
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