发明名称 SPUTTERING METHOD FOR FORMING UNFORM FILM AND EVAPORATION FILM
摘要 PURPOSE:To provide a sound evaporation film uniform in the thickness and quality with the substrate so arranged than nay point on the substrate can be sputtered with the target within the range of the same phase in the local magnetic field thereon.
申请公布号 JPS549176(A) 申请公布日期 1979.01.23
申请号 JP19770073876 申请日期 1977.06.23
申请人 ULVAC CORP 发明人 HAYASHI CHIKARA
分类号 C23C14/36;C23C14/35;C23C14/54;C23C14/56 主分类号 C23C14/36
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