发明名称 |
SPUTTERING METHOD FOR FORMING UNFORM FILM AND EVAPORATION FILM |
摘要 |
PURPOSE:To provide a sound evaporation film uniform in the thickness and quality with the substrate so arranged than nay point on the substrate can be sputtered with the target within the range of the same phase in the local magnetic field thereon. |
申请公布号 |
JPS549176(A) |
申请公布日期 |
1979.01.23 |
申请号 |
JP19770073876 |
申请日期 |
1977.06.23 |
申请人 |
ULVAC CORP |
发明人 |
HAYASHI CHIKARA |
分类号 |
C23C14/36;C23C14/35;C23C14/54;C23C14/56 |
主分类号 |
C23C14/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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