| 摘要 |
<p>PURPOSE:To provide a method for mounting a component in which a thermal stress to be received by the component and a printed circuit board at the time of mounting the component is reduced to enhance reliability of a product. CONSTITUTION:A method for mounting a component 10 on a wiring pad 21 of a printed circuit board 20 by using adhesive comprises the steps of coating a component terminal 11 or the pad 21 with main agent 30a of conductive adhesive 30 containing the conductive main agent 30a and hardening agent 30b and the other with the agent 30b, and curing it by thermal press-bonding.</p> |
