| 摘要 |
PURPOSE: To reduce the reaction applied to a rotating wafer, and to appropriately support its surface to be ground by providing a split type driven lower roller to support a work to be engaged with a grinding member. CONSTITUTION: A wafer 100 to be ground is located between upper and lower rollers 102, 104 to achieve the grinding. The lower roller 104 comprises two split members 192, 194, and the respective lower roller members 192, 194 are fitted to a shaft forming a journal by a frame 198. Because the frame 198 forms a gimbal in one direction, a shaft of the lower roller 104 is operable in a two-dimensional manner, and compensates any non-uniform part on a rear surface of the wafer 100. By using the lower roller 104, the reaction applied to the rotating wafer 100 during the grinding can be suppressed, and the surface to be ground of the wafer 100 can be appropriately supported. |
