| 摘要 |
An electrostatic chuck for holding a semiconductor wafer in a fixed plane relative to said chuck, which chuck comprises an electrically conductive member separated from said fixed plane by a layer of dielectric material, means for electrically contacting the wafer, and means for supporting the wafer in said plane, characterized in that the chuck further comprises thermally conductive portions for contacting the wafer, and in that the electrically conductive member has parts which extend laterally between said thermally conductive portions, the dielectric layer extending at least one said parts. |
