| 摘要 |
<p>PURPOSE:To reduce the adhesive force of an adhesive sheet by cross-linking and hardening sufficiently the sheet by emitting ultraviolet rays on the sheet and at the same time, to prevent crazing in an adhesive layer even if the extensibility of the sheet exceeds a certain value by an expander in the following process and to make it possible to perform easily a pickup in the following process without causing a separation of a wafer chip. CONSTITUTION:As an adhesive sheet for semiconductor wafer dicing use, an ultraviolet transmitting surface base material, which has a superior expansivity, consists of an internal plasticizing polyvinyl chloride film having a low electric resistance value and has an ultraviolet hardening type adhesive layer, which has an adhesive force to be reduced by the emission of ultraviolet rays and is formed on one surface of the base material, is used.</p> |
