| 摘要 |
<p>PURPOSE:To enhance a molded type semiconductor device equipped with semiconductor chips in reliability. CONSTITUTION:A lead frame is equipped with support plates 2a to 2f where semiconductor chips 11a to 11f are fixed and a wiring conductor board 4 where the chips 11a to 11f are interconnected. A heat sink 13, equipped with first conductor layers 31a to 31f and second conductor layers 32a to 32f provided onto a heat sink through the intermediary of a thin insulating layer 13b, is arranged on support plates 2 and the wiring conductor board 4. The wiring board 4 is fixed to the second conductor layers by soldering. Therefore, the wiring conductor board 4 is supported by the second conductor layers in a sporadic manner.</p> |
