| 摘要 |
A double mount type structure for mounting a plurality of electronic circuit packages, including a box-shaped shelf, front and rear sub units accommodated in the shelf and having front and rear back wiring boards, respectively, each having connectors through which a plurality of the packages can be mounted on the back wiring board. The rear wiring board is fixed to the shelf and, on the other hand, the front wiring board is movable between a closed position and an opened position thereof, so that, when the front back wiring board is in the opened position, the rear sub unit is accessible and, therefore, the packages can easily be loaded on and unloaded from the rear sub unit.
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