Burn-in apparatus and method for self-heating semiconductor devices having built-in temperature sensors

摘要

A burn-in apparatus for use in burn-in tests includes a burn-in test chamber for accommodating a plurality of semiconductor devices to be tested. The burn-in apparatus further includes measuring means for detecting electric characteristics of temperature sensors built in semiconductor devices to measure junction temperatures of the semiconductor chips built in the semiconductor devices. Based on outputs of the measuring means, control means controls electric power feed amounts to the integrated circuits of the semiconductor chips and/or environmental temperatures in the burn-in test chambers. Thus, the junction temperatures are maintained in a set temperature range, and accuracy of screening tests can be improved.