VERFAHREN ZUR HERSTELLUNG VON ELEKTRISCH LEITENDEN UND LOETBAREN ANORDNUNGEN
摘要
Paste composition for producing an electrically conductive and solderable structure along with the resulting article are disclosed. Metal particles, metal salts and an organic polymer binder are formed into a paste which is applied to a non-conductive substrate by printing or the like. The paste is heated to permit metal salts to migrate to the surface of the binder where they become concentrated. During metallizing the salts are removed by the bath and metal is deposited in pores formed in the binder by the dissolved salts. The metal layer is adherent to the binder and provides good solderable points.
申请公布号
DE2728465(A1)
申请公布日期
1979.01.11
申请号
DE19772728465
申请日期
1977.06.24
申请人
PREH,ELEKTROFEINMECHANISCHE WERKE JAKOB PREH NACHF