| 摘要 |
<p>The workpieces are first presoldered, and are then aligned with preforms in a jig and heat is applied to complete the soldering operation. The solder preforms are pref. balls, and/or hemispheres, and/or cylinders, and/or cubes, and/or strips; and are esp. made of soft solder, viz. Sn, Pb, In or alloys of these metals, and possibly including other metals such as Ag. The solder preforms are pref. melted in the jigs via a hydrogen flame and/or in a continuous electric furnace contg. a protective atmos. Used for soldering semiconductor elements and integrated circuits, esp. very fine contacts onto triple-diffused semiconductors with open pn-junctions on the surface or onto power semiconductors so the properties of the devices are not impaired.</p> |
