Apparatus for cooling heat generating electrical components.

摘要

The apparatus comprises integrated circuit chips (10) which are to be cooled. …Heat is conducted from the chips (10) to a cold plate (36) by a heat transfer path including spring biased heat conducting members (26) and housing (16). …A thermal adapter (42) is sandwiched between the housing (16) and the cold plate (36) and introduces predetermined heat transfer characteristics between the housing and the plate. …The adapter can be a good or poor conductor. The adapter can comprise cut-out regions aligned with low powered chips to increase the thermal resistance to heat flow from those chips while the remaining regions, aligned with high powered chips, have a lower thermal resistance. This permits both the low and high powered chips to attain their optimum operating temperature.