发明名称 Thick film deposition of microelectronic circuit
摘要 A process for depositing thick film electronic material which forms electric circuits on the inside wall of right circular substrates. The process includes the determination of a circuit pattern wherein a light sensor is used to actuate electronics which in turn controls the flow of the thick film paste for deposition on the substrate inside wall. The substrate is rotated and translated in conjunction with the movement of a light sensor in the x-y plane.
申请公布号 US4133910(A) 申请公布日期 1979.01.09
申请号 US19770856438 申请日期 1977.12.01
申请人 THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE ARMY 发明人 RUWE, VICTOR W.;GRABEN, THOMAS D.
分类号 B05B13/06;H01L21/70;H05K1/00;H05K3/12;(IPC1-7):B41M3/08;B05D5/12 主分类号 B05B13/06
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