发明名称 |
Apparatus for covering electronic components with plastic material |
摘要 |
A machine for covering electronic components with a low-pressure molding compound while said components are carried by a strip comprises a closing unit assembly, which is rotatable on an axis of rotation and comprises two angularly spaced apart, C-shaped closing sub units, each of which has an open side remote from said axis of rotation and comprises mold means and is operable to open and close said mold means. Each of said closing sub-units is operable to a first position, in which its mold means are adapted to enclose electronic components carried by a strip and to receive said molding compound to cover said components, and to a second position, in which its mold means are open. Said closing unit assembly is operable to move said closing sub-units in alternation to said first position and to move each closing sub-unit to said second position while moving the other closing sub-unit to said first position. The machine further comprises cleaning means operable to clean said mold means of each of said closing sub-units when the same is in said second position.
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申请公布号 |
US4133621(A) |
申请公布日期 |
1979.01.09 |
申请号 |
US19760696580 |
申请日期 |
1976.06.16 |
申请人 |
MASCHINENFABRIK LAUFFER & BUTSCHER |
发明人 |
PLOCHER, WERNER;LAUFFER, HANS-MARTIN |
分类号 |
B29C33/72;B29C45/14;B29C45/17;(IPC1-7):B29F1/10 |
主分类号 |
B29C33/72 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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