Improvements in or relating to integrated circuits

摘要

The invention concerns a process for the realisation of connection bumps (13) on integrated circuits or chips which provides for a selective deposition of a Sn/Zn welding alloy onto the pads (12) of the chip (11), without that chip (11) being subjected to any surface treatment. The Sn/Zn based alloy has the feature that it is welded directly onto the aluminium pads of the chip.