| 发明名称 |
SCRIBING METHOD FOR SEMICONDUCTOR WAFER |
| 摘要 |
PURPOSE:To ensure a good scribing by irradiating the laser pulse more than twice onto the same street of the substrate with variation of the repetitive frequency. |
| 申请公布号 |
JPS54860(A) |
申请公布日期 |
1979.01.06 |
| 申请号 |
JP19770065911 |
申请日期 |
1977.06.03 |
| 申请人 |
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发明人 |
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| 分类号 |
B23K26/00;H01L21/301;H01L21/304 |
主分类号 |
B23K26/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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