| 发明名称 |
RESIN SEAL SEMICONDUCTOR DEVICE |
| 摘要 |
<p>PURPOSE:To make even the thermal stress being applied to connecting wires by providing dummy pads and disposing the connecting wires to be nearly symmetrically to a semiconductor chip and a package respectively.</p> |
| 申请公布号 |
JPS54578(A) |
申请公布日期 |
1979.01.05 |
| 申请号 |
JP19770064840 |
申请日期 |
1977.06.03 |
| 申请人 |
HITACHI LTD |
发明人 |
OOI EIJI;NAKASHIMA TADAYASU |
| 分类号 |
H01L23/12;H01L23/28 |
主分类号 |
H01L23/12 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
