发明名称 |
ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component embedded printed circuit board and a method of manufacturing the same.SOLUTION: An electronic component embedded printed circuit board includes: an electronic component 130 embedded such that a connection terminal 131 is exposed on one surface of an insulation layer 140; and a metal bump 195 formed to the exposed connection terminal 131 of the electronic component 130 on the one surface of the insulation layer 140. An external component is directly connected with the exposed connection terminal 131 of the electronic component 130 without a need of processing a via hole. As a result, signal transfer is advantageous and transmission loss can be minimized.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016134621(A) |
申请公布日期 |
2016.07.25 |
申请号 |
JP20150252477 |
申请日期 |
2015.12.24 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
PARK HO-SIK;LEE DONG-KEUN;CHOI JAE-HOON;LEE SANG-JAE;LIM SUNG-TAEK |
分类号 |
H05K3/46;H01L23/12;H01L25/065;H01L25/07;H01L25/18 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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