| 摘要 |
PURPOSE:To simplify the manufacturing device of semiconductor device so as to extremely improve the production efficiency of the device by pressing at least two semiconductor elements against an insulating substrate when electrodes are electrically connected with a wiring pattern by pressing a plurality of semiconductor elements against the insulating substrate. CONSTITUTION:A wiring pattern 2 is formed on a substrate 1 so that part of the pattern 2 can face metallic projections 3 and the projections 3 on a semiconductor element 6 and the pattern 2 on the substrate are pressed against each other from the top side of the element 6 by means of a collective press- contacting jig 8. As a result, an insulating resin 5 between the projections 3 and pattern 2 is pushed out. When the resin 5 is pushed out, the resin 5 is hardened or made to become sticky by applying external energy so that the projections 3 can be electrically connected to the pattern 2 and, at the same time, the element 6 can be mechanically supported with the substrate 1. At the time of the connection, a plurality of semiconductor elements are pressed against the substrate at once by using the collective press-contacting jig 8. |
