发明名称 Partial encapsulation of adhesive coating materials on envelop flaps - for pressure sensitive bonding using various adhesive systems
摘要 <p>Mutually adhesive coatings on complementary regions of one article such as an envelope or self-sealing postcard are inhibited from premature adhesion by enclosing >=1 part of the coating system in microcapsules bonded to the support surface and inert until subjected to sufficient pressure to break the capsules. Esp. suitable for two-component adhesive systems, with the catalytic component being encapsulated. This avoids use of ancillary temporary interlayers such as siliconised paper and can be used for application of a wide variety of adhesive systems and for cold or hot pressure sealing processes. For water soluble adhesives, the encapsulated agent may be water.</p>
申请公布号 FR2392097(A1) 申请公布日期 1978.12.22
申请号 FR19770004180 申请日期 1977.02.15
申请人 HERVE ET FILS SA 发明人 PIERRE BOUGE
分类号 B05C9/06;B42D5/02;B42D15/08;B65D27/16;C09J5/04;(IPC1-7):09J5/00;65D27/00 主分类号 B05C9/06
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