| 发明名称 |
SEMICONDUCTOR DEVICE AND PRODUCTION OF THE SAME |
| 摘要 |
PURPOSE:To eliminate the need for discriminatio of the front and back at the time of peleet bonding by preparing lead assemblies which are usable commonly for both front and back of pellets in a semiconductor device of at least 3 termianls.
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| 申请公布号 |
JPS53147464(A) |
申请公布日期 |
1978.12.22 |
| 申请号 |
JP19770062396 |
申请日期 |
1977.05.28 |
| 申请人 |
HITACHI LTD |
发明人 |
MATSUZAKI MITSUSACHI |
| 分类号 |
H01L21/52;H01L21/50;H01L23/02;H01L23/08;H01L23/48 |
主分类号 |
H01L21/52 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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