Curing of epoxy resin systems using halfester compounds containing aliphatic tertiary amino groups

摘要

Half-ester compounds obtained by reacting polycarboxylic acid anhydrides with aliphatic tertiary amino alcohols have excellent latent characteristics as a curing catalyst for epoxy resins which are normally catalyzed by tertiary amines. When epoxy resin compositions containing the half-ester compounds are applied to semiconductor devices, remarkably small leakage currents of the devices are observed.