| 摘要 |
A radio frequency transponder (10) comprises a substrate (12) having an electrically conductive material disposed thereon, and a superstrate (18) having an integrated circuit retention aperture. The superstrate is laminated to the substrate and substantially covers the electrically conductive material on the substrate. An integrated circuit (16) is substantially retained within the integrated circuit retention aperture and is operatively connected to the electrically conductive material. The substrate and superstrate may be each comprised of an organic material. The electrically conductive material comprises a metal material patterned to provide an antenna (14). An encapsulant material is disposed within the integrated circuit retention aperture substantially enclosing the integrated circuit therein. In another embodiment of the invention, an additional superstrate is provided on an opposite side of the substrate from the first superstrate. The substrate layer further includes a second integrated circuit retention aperture, and the integrated circuit is retained within both the first and second integrated circuit retention apertures. In yet another embodiment of the invention, the superstrate is laminated to the opposite side of the substrate only, and the integrated circuit retention aperture is provided in the substrate. Each of the embodiments of the invention provides a chip-in-cavity package having a relatively small form factor. |
