| 摘要 |
<p>PURPOSE:To obtain a film carrier tape which does not induce increase in electrical resistance and deformation of a lead by making thinner the thickness of a lead on the side connected to an electrical pad of a semiconductor chip than that of other regions. CONSTITUTION:A sprocket hole, a ladder-shaped hole 13 for forming a suspender 8, and a hole 3 for inserting a semiconductor chip are opened at a resin film 6 by press machining. Then, after adhering a metal foil 14 such as copper which is for example 35mum in board thickness to the resin film 6, etching removal is made so that the part of the metal foil 14 which is located at the region of the hole 3 may be half the thickness. The metal foil 14 at a region other than those where a lead is formed is removed by etching to form a lead 4a. In this manner, the thickness of the side to be connected to a bump 7 of an electrode pad of a semiconductor chip of the lead 4a can be made thinner than that of other regions of the lead. Thus, a film carrier tape which does not induced increase in electrical resistance and deformation of lead can be obtained.</p> |
