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发明名称
AUTOMATIC WIRE BONDING DEVICE OF SEMICONDUCTOR DEVICE
摘要
PURPOSE:To automatically eliminate trouble and perform wire bonding without exchanging capillary and without repair by manual labor even when the capillary is clogged with gold wire.
申请公布号
JPS53144669(A)
申请公布日期
1978.12.16
申请号
JP19770060024
申请日期
1977.05.23
申请人
MITSUBISHI ELECTRIC CORP
发明人
SHIMANUKI MAKOTO
分类号
H01L21/60
主分类号
H01L21/60
代理机构
代理人
主权项
地址
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