APPARATUS AND METHOD FOR ELECTROLYTICALLY DEPOSITING COPPER ON A SEMICONDUCTOR WORKPIECE,申请号KR1020007008286-传众专利搜索

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发明名称	APPARATUS AND METHOD FOR ELECTROLYTICALLY DEPOSITING COPPER ON A SEMICONDUCTOR WORKPIECE
摘要
申请公布号	KR20010034468(A)	申请公布日期	2001.04.25
申请号	KR1020007008286	申请日期	2000.07.28
申请人		发明人
分类号	H01L21/20	主分类号	H01L21/20
代理机构		代理人
主权项
地址

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