| 摘要 |
PROBLEM TO BE SOLVED: To provide a connection device having a contact terminal capable of coming into contact with an object to be inspected at many points and with high density and provide a manufacturing method thereof SOLUTION: A hole which becomes a mold for forming the contact terminal 103 is formed by anisotropic etching for a silicone wafer, and the contact terminal 103, an insulation film 104 made of polyimide film, and a wiring for pulling out 105 are formed using this mold. A silicone wafer which becomes a buffer layer 108 and a substrate 109 is sandwiched between the insulation film 104 and a wiring substrate 107 to integrate them, and the mold is removed. Then, the wiring for pulling out 105 is connected with an electrode 110a of the wiring substrate 107 by solder 111.
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