发明名称 METHOD FOR LAYING FLOOR BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method for laying floor boards capable of smoothly coupling the floor boards each having a plurality of coupling portions different in coupling direction at connecting end sections without damaging the coupling portions. SOLUTION: A cushion material C having the thickness of about 2-3 mm and made of a polyethylene foam sheet, a polystyrene foam sheet or the like is installed on a floor substrate material B, then the first floor board 1 is installed at the prescribed position of the cushion material C. The second floor board 1 is inclined so that one end section having a back face side cut section 12 is faced downward, the back face side cut section 12 is inserted into the surface side cut section 11 of the first floor board 1 to couple a male tongue 14 with a female tongue 13. A projection 16 is coupled with a recess 15, thereby the floor boards 1 are connected together in the short direction and installed in sequence on the cushion material C.
申请公布号 JP2001323639(A) 申请公布日期 2001.11.22
申请号 JP20000139616 申请日期 2000.05.12
申请人 EIDAI CO LTD 发明人 ARIKI HITOSHI;IWATANI KAZUHIRO;FUJIMOTO RYOJI;MURAKAMI KAICHIRO
分类号 E04F15/02;E04F15/00;(IPC1-7):E04F15/02 主分类号 E04F15/02
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