发明名称 METHOD FOR FORMING FINE PLATING PATTERN
摘要 PROBLEM TO BE SOLVED: To provide a method for effectively forming various metallic plating patterns required for fine plating for producing a magnetic head with a high precision. SOLUTION: This method for forming fine plating patterns includes a stage (i) in which a first resist pattern capable of feeding acid to the surface of a core substrate as a conductor is formed, a stage (ii) in which a second resist layer which does not dissolve the first resist pattern but makes the same hard to dissolve or insolubilize the same is formed on the outer wall of the first resist pattern, a stage (iii) in which a layer made hard to dissolve or insolubilized is formed on the boundary part between the first resist pattern and the second resist pattern, a stage (iv) in which two layer patterns of the first resist pattern and the layer made hard to dissolve or an insolubilized layer are formed on the second resist pattern, and (v) a stage in which a conductor pattern is adhered and formed with the two layer patterns as masks by plating or electroless plating.
申请公布号 JP2001323393(A) 申请公布日期 2001.11.22
申请号 JP20000143033 申请日期 2000.05.16
申请人 SHIN ETSU CHEM CO LTD 发明人 KATO HIDETO;FURUHATA TOMOYOSHI;UEDA TAKASHI
分类号 C23C18/31;C25D5/02;C25D7/00;G11B5/31;(IPC1-7):C25D5/02 主分类号 C23C18/31
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