发明名称 PRODUCTION METHOD FOR SEMICONDUCTOR WAFER
摘要 PURPOSE:To facilitate the handling as well as to avoid the stains or injury on the surface by forming a wafer aggregate which is coupled via part of the semiconductor wafer.
申请公布号 JPS53144258(A) 申请公布日期 1978.12.15
申请号 JP19770058955 申请日期 1977.05.21
申请人 MITSUBISHI ELECTRIC CORP 发明人 YAMAMOTO ISAMU
分类号 H01L21/304;H01L21/302 主分类号 H01L21/304
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