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发明名称
PRODUCTION METHOD FOR SEMICONDUCTOR WAFER
摘要
PURPOSE:To facilitate the handling as well as to avoid the stains or injury on the surface by forming a wafer aggregate which is coupled via part of the semiconductor wafer.
申请公布号
JPS53144258(A)
申请公布日期
1978.12.15
申请号
JP19770058955
申请日期
1977.05.21
申请人
MITSUBISHI ELECTRIC CORP
发明人
YAMAMOTO ISAMU
分类号
H01L21/304;H01L21/302
主分类号
H01L21/304
代理机构
代理人
主权项
地址
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