| 摘要 |
A multichip module comprising a substrate (1, 11) with components (2a - 2f) connected to it, said module comprising connection pieces for its connection to a circuit board. The substrate (1) is substantially film-like and flexible. The components (2a - 2f) are connected to either side of the substrate (1). Fitted on either side of the substrate (1) are filler layers (4, 5) to stiffen the structure. Using the multichip module of the invention, a very compact package is achieved and a small surface area is needed on the circuit board because the components can be packed in two or more layers on either side of the substrate. |
