发明名称 FABRICATION MULTILAYER COMBINED RIGID/FLEX PRINTED CIRCUIT BOARD
摘要 A multilayer rigid flex printed circuit board, wherein the board laminate com- prises a double-sided basestock compos- ite, formed by laminating two conducting sheets (12 and 14) to an insulating layer, said insulator layer containing a flexible core (20), a second insulator layer (24 and 26) affixed to each side of the basestock, said insulator having a cutout region prox- imate to the flexible core of the basestock composite, a flexible layer (28 and 30) af- fixed to said cutout regions with an adhe- sive, wherein said flexible layer contacts the conducting layers and abuts and over- laps a portion of the second insulator layer such that upon stacking of the board lam- inate a hollow region (32) is produced as between the stacked laminate sections.
申请公布号 CA2184373(C) 申请公布日期 2002.01.29
申请号 CA19942184373 申请日期 1994.03.08
申请人 TELEDYNE INDUSTRIES INC. 发明人 MILLETTE, LEE J.;CARON, A. ROLAND;THOMAN, JOSEPH A.
分类号 H05K1/02;H05K3/00;H05K3/46;(IPC1-7):H05K1/03 主分类号 H05K1/02
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