LIGHT EMITTING DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide highly reliable packaging for a semiconductor light emitting element. SOLUTION: Electric wiring is formed to be buried at the part of an insulation layer on a PWB(printed wiring board) 101 by etching. Solder bumps are formed on the PWB. A gallium nitride based semiconductor element 102 is mounted on the substrate including the electric wiring and lead bonded. Sol-gel solution of glass is admixed with phosphor and applied and then finished into a glass body by heating. The phosphor combines blue light excitation, green light emission and blue light excitation, red light emission.