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发明名称
METHOD OF BONDING LEAD FRAME TO HEAT DISSIPATING PLATE
摘要
申请公布号
JPS53142869(A)
申请公布日期
1978.12.12
申请号
JP19770057910
申请日期
1977.05.18
申请人
NICHIDEN KIKAI KK
发明人
KOIKE MINORU
分类号
H01L23/34;H01L21/48;H01L23/48
主分类号
H01L23/34
代理机构
代理人
主权项
地址
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