| 发明名称 |
MANUFACTURE OF SEMICONDUCTOR DEVICE |
| 摘要 |
PURPOSE:To connect fine wires accurately by previously plasma-etching and removing an insulation film on a junction pad surface. |
| 申请公布号 |
JPS53141574(A) |
申请公布日期 |
1978.12.09 |
| 申请号 |
JP19770056720 |
申请日期 |
1977.05.16 |
| 申请人 |
NIPPON ELECTRIC CO |
发明人 |
NAKAMAE MASAHIKO;KAMATA SAZUKU |
| 分类号 |
H01L21/302;H01L21/263;H01L21/30;H01L21/3065;H01L21/60 |
主分类号 |
H01L21/302 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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