| 摘要 |
PURPOSE:To enable the common use of manufacturing equipments until tie bars are cut by providing a plurality of tie bars which serve as leads connecting lead segments with a longitudinal frame so as to intersect perpendicularly to each of the lead segments. CONSTITUTION:A semiconductor element is mounted on a mounting segment 25; internal wirings are arranged in lead segments 23, 24, 26, 27; then these are resin-molded by transfer molding method and the like. Tie bars 28-31 which are arranged on both sides of each of the lead segments 23, 24, 26, 27 and serve as leads are cut along each of the lead segments 23, 24, 26, 27, and rectilinear lead terminals are formed, thereby completing a DIP semiconductor device. The tie bars are similarly cut so as to leave L-shaped parts, and bent lead terminals are formed, thereby completing an SIP type semiconductor device. Thus, by using same lead frame, two kinds of semiconductor devices, i.e. a dual-in-line package(DIP) type and a single-in-line package(SIP) type, can be supplied, and the manufacturing equipments can be commonly used until the tie bars are cut. |
