首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
PACKAGING METHOD OF SEMICONDUCTOR CHIPS
摘要
申请公布号
JPS53139976(A)
申请公布日期
1978.12.06
申请号
JP19770055199
申请日期
1977.05.13
申请人
SUWA SEIKOSHA KK
发明人
SATOU SATOSHI
分类号
H01L21/60
主分类号
H01L21/60
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Systems and methods for supporting tubular members
Hydraulic control system for vehicle
Turbo transmission mechanism for brush cutter
Toothed wheel and pump aggregate with such a toothed wheel
Electromechanical actuator and actuator unit
Constant-velocity joint
Intermediate shaft
Method and apparatus for mounting a machine element onto a shaft
Moment relief barrel washer
Rotation indicating device, particularly for allen bolts
Hydraulic pressure control device for construction machinery
Turbo-molecular pump
Centrifugal blower assembly and method for assembling the same
Adhesive promoter
Solvent free aqueous polyurethane dispersions and methods of making and using the same
Clearcoat coating composition, method for production and use
UV curable metallic decorative compositions
Low gloss radiation-curable compositions
Ink compositions comprising surfactants having limited solubility
Ink composition, ink cartridge, ink recording device, and recorded matter
