| 摘要 |
The invention relates to baking finishes of low solvent content, consisting essentially of an acrylate resin, an epoxy resin and a mixture of organic solvents, with or without pigment, catalyst and other conventional auxiliaries, in which the acrylate resin is a copolymer which contains from 10 to 35% by weight of alpha , beta -olefinically unsaturated carboxylic acids as copolymerized units, has a very low K value and has an acid number of from 70 to 250 mg of KOH/g, the epoxy resin contains at least 2 oxirane groups per molecule and the mixture of organic solvents is a mixture of from 20 to 80% by weight of a solvent having a boiling point of from 100 DEG to 280 DEG C and a dielectric constant of from 2 to 4.99, and from 80 to 20% by weight of a solvent having a boiling point of from 80 DEG to 200 DEG C and a dielectric constant of from 5 to 27. The weight ratio of acrylate resin to epoxy resin is from 9:1 to 6:4.
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