发明名称 OP GROTE SCHAAL GEINTEGREERDE SCHAKELING MET EEN EXTERN INTEGRAAL TOEGANKELIJKE TESTSCHAKELING EN EEN OVEREEN- KOMSTIGE WERKWIJZE.
摘要 A large scale integrated circuit with external integral access test circuitry having a semiconductor body with a surface. A large scale integrated circuit is formed in the semiconductor body through the surface and comprises a large number of interconnected circuit elements with a large number of input and output pads connected to the circuit elements and disposed near the outer perimeter of the semiconductor body. An integrated test circuit is formed in the semiconductor body and extends through the surface. The integrated test circuit has a plurality of probe pads carried by the semiconductor body and connected to the test circuit. The integrated test circuit is formed external of but in relatively close proximity to the large scale integrated circuit. Leads are provided on the semiconductor body which connect the integrated test circuit to the large scale integrated circuit whereby access can be obtained to the large scale integrated circuit through probing of the probe pads of the integrated test circuit to ascertain the characteristics of the large scale integrated circuit.
申请公布号 NL7805834(A) 申请公布日期 1978.12.04
申请号 NL19780005834 申请日期 1978.05.30
申请人 FUJITSU LIMITED TE KAWASAKI, JAPAN. 发明人
分类号 G01R31/28;G01R31/3185;H01L21/60;H01L21/66;H01L21/822;H01L27/02;H01L27/04;(IPC1-7):01L27/06;01L21/72 主分类号 G01R31/28
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